ヒットリサーチロゴ 
温度制御回路
Hotend intelligent control circuit
(Optional)

Other products to follow
New 2 types of hotends
(On-demand-like) and
500 Yen coin size comparison
New applications possibilities with multi-functionality
Features
1) Material up to 500 ℃
Hi-temp resin: PC, PTFE, PEEK, TPI, electro-conductive resin
Low melting point metal: In, Sn, Zn, Ag, Au alloy, mixtures
Glasses : Low melting point glasses (glazing, enameling)
Multiple mixture system : Inorganic powder, short fiber,
capsule, nano substance
2) Small/light, intelligent hotend
Energy saving (heat quantity, movement), shorter time
Hotend configuration, multiple heater/sensor
discharge nozzle, insulation/heat-sinking construction
High speed movement to shorten making time
On-demand-like thermal response, variable internal zone
temperature
3) Multiple material simultaneous modeling
Integration of multiple hotends
Multiple row arrangement of integrated hotends
Independent temperature setup, fast melting discharge modeling
shortening of time
Reduction of material deterioration / varying discharge amount
World first, high-temperature, novel & new concept small hotend for FDM 3D for 500℃ application now available
Temperature control circuit
(optional)
 Home  About us  News  Technology  Inquiry
Copyright© 2017 HIT Research Corporation
All Rights Reserved